EXHIBITOR LIST

Unisem Europe Ltd.
Parkway, Pen-y-fan Industrial Estate
Croespenmaen, Crumlin, NP11 3XT GB
(T) 209-534-6398
(F)
(E) cstai@unisemgroup.com
(W) www.unisemgroup.com

Booth: 112

Unisem offers an integrated suite of packaging and test services such as wafer bumping, wafer probing, wafer grinding, a wide range of of leadframe and substrate IC packaging including leaded, QFN, BGA and FlipChip packages, and high-end RF and mix-signal test services. The company's turnkey services include design, assembly, test, failure analysis, and electrical and thermal characterization.

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