PROGRAM
GSA & IET are pleased to provide the 2009 program focused on leveraging and maximizing European expertise in analog/mixed-signal, wireless and MEMS applications, as well as addressing markets for ASICs and packaging trends. View the 2009 program abstracts.
Tuesday, 2 June 2009
| Time |
Event |
| 13:30 - 17:00 |
Registration and Networking |
| 14:30 - 14:45 |
Welcome Address
Michelle Richmond, Director, Membership &
Professional Development, The Institution of Engineering and Technology
|
| 14:45 - 16:00 |
Opening Panel: Analog/Mixed Signal: Driving Solutions
to Leverage Expertise Throughout Europe
Moderator: Maria Marced, President, TSMC Europe
Panelists:
- Andreas Bertl, Senior Director, Analog
Technology and Exploration, Infineon Technologies AG
- Pierre Bricaud, Director, IP Engineering, Solutions Group, Synopsys, Inc.
- Mark Redford, Vice President Advanced Process
Technology Development, CSR Plc.
- Wesley Ryder, Worldwide Technical Director, Mentor Graphics
|
| 16:00 - 16:45 |
Presentation: Module Packaging Trends
Mohamed Wahab, Managing Director, DELTA Microelectronics Ltd.
|
| 16:45 - 17:00 |
Keynote Introduction
Dwight Decker, Board Chairman, Global Semiconductor Alliance |
| 17:00 - 17:45 |
Keynote Address: Global Economic Outlook
Julian Callow, Chief European Economist, Barclays Capital
|
| 17:45 - 18:45 |
Networking Reception |
| 18:45 |
 VIP Dinner
Sponsored by eSilicon
|
Wednesday, 3 June 2009
| Time |
Event |
| 8:00 - 15:00 |
Registration and Networking |
| 8:00 - 8:45 |
 Breakfast Refreshments and Networking
Sponsored by TSMC
|
| 8:45 - 9:00 |
Welcome Address
Jodi Shelton, President, Global Semiconductor Alliance
|
| 9:00 - 9:45 |
Keynote Address: Redefining Mobility: Overcoming the Industry's Next Challenge
Steve Mollenkopf, Executive Vice President & President, QUALCOMM CDMA Technologies
|
| 9:45 - 11:00 |
Town Hall Discussion: The Emerging Semiconductor Business Model – Sustainability and Future Growth
Moderator: Lip-Bu Tan, President and Chief Executive Officer, Cadence Design Systems
Panelists:
- Simon Atkinson, Chief Executive Officer and Founder, Mirics Semiconductor, Inc.
- David Baillie, Chief Executive Officer, Cambridge Semiconductor
- Stan Boland, President and Chief Executive Officer, Icera, Inc.
- Tudor Brown, President, ARM Holdings
- Joep van Beurden, Chief Executive Officer, CSR Plc.
|
| 11:00 - 11:15 |
Networking Break |
| 11:15 - 12:00 |
Presentation: Are ASIC's Really on the Decline? The ASIC Model: Future Directions
Tatsuo Noguchi, Technology Executive, Semiconductor Technology Laboratories, TOSHIBA Corporation
|
| 12:00 - 13:00 |
Networking Lunch
Sponsored by TSMC
|
| 13:00 - 13:45 |
Presentation: Portable Device Power Management: Evolution from Discretes to Configurable System Power Management Platform IC’s
Mark Jacob, Director of Marketing Audio & Power Management Business Unit, Dialog Semiconductor
|
| 13:45 - 15:00 |
Panel: MEMS: The New Dimension of the Advanced Analog World
Moderator: Benedetto Vigna, Group Vice President & General Manager of MEMS & Sensors, Transceivers and Healthcare Division, STMicroelectronics
Panelists:
- Volker Herbig, Manager Strategic Marketing, X-FAB Semiconductor Foundries AG
- David Ruffieux, Expert RF and Analog IC Design, Microelectronics, CSEM (Swiss Center for Electronics and Microtechnology)
- Dr. Massimo Sivilotti,
Chief Scientist, Tanner EDA
- Steve Wainwright, General Manager EMEA, Vice President Sales and Marketing, Freescale Semiconductor
|
| 15:00 - 16:00 |
Keynote Address: IC Design: Rethink Everything for Recovery Readiness!
Dr. Aart de Geus, Chairman of the Board and Chief Executive Officer, Synopsys, Inc.
|
| 16:00 |
Closing Remarks and Conclude |
|
